Hybrid integration of photonic chips with single-sided coupling
文献类型：专利
| 作者 | AALTO, TIMO; CHERCHI, MATTEO; HARJANNE, MIKKO; GUINA, MIRCEA |
| 发表日期 | 2019-03-14 |
| 专利号 | WO2019048740A1 |
| 著作权人 | TEKNOLOGIAN TUTKIMUSKESKUS VTT OY |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Hybrid integration of photonic chips with single-sided coupling |
| 英文摘要 | According to an example aspect of the present invention, there is provided a method for integrating photonic circuits (201, 203) comprising optical waveguides (204, 205), where a smaller chip (203) with at least one first photonic circuit is aligned and bonded on top of a larger chip (201) having at least one second photonic circuit in order to couple light between optical waveguides (204, 205) on each chip (201, 203), wherein optical coupling between the waveguides (204, 205) on said chips (201, 203) occurs from a single side (211) of said smaller chip. |
| 公开日期 | 2019-03-14 |
| 申请日期 | 2018-09-07 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57737]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TEKNOLOGIAN TUTKIMUSKESKUS VTT OY |
| 推荐引用方式 GB/T 7714 | AALTO, TIMO,CHERCHI, MATTEO,HARJANNE, MIKKO,et al. Hybrid integration of photonic chips with single-sided coupling. WO2019048740A1. 2019-03-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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