Photonic chip with bending optical path and integrated collimation structure
文献类型：专利
| 作者 | MENEZO, SYLVIE; BOUTAMI, SALIM; MOUREY, BRUNO |
| 发表日期 | 2019-06-12 |
| 专利号 | EP3495861A1 |
| 著作权人 | COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Photonic chip with bending optical path and integrated collimation structure |
| 英文摘要 | A photonic chip comprising a light guiding layer supported by a substrate and covered with an encapsulation layer. The chip has a front face on the side of the encapsulation layer and a back face on the side of the substrate. The light guiding layer includes a light guiding structure optically coupled to a vertical coupler configured to receive light from the waveguide and to form a light beam directed towards either the front face or the back face. The chip also comprises a collimation structure formed at least partly in the light guiding layer and an arrangement of one or several reflecting structures each on either the front face or on the back face. This arrangement is made so as to assure propagation of light between the vertical coupler and the collimation structure along an optical path with at least one fold. |
| 公开日期 | 2019-06-12 |
| 申请日期 | 2018-12-05 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/57760]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES |
| 推荐引用方式 GB/T 7714 | MENEZO, SYLVIE,BOUTAMI, SALIM,MOUREY, BRUNO. Photonic chip with bending optical path and integrated collimation structure. EP3495861A1. 2019-06-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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