Versatile semiconductor package, module and method of operation
文献类型：专利
| 作者 | KMETEC JEFFREY D.; VOS FRANS M. |
| 发表日期 | 2010-12-10 |
| 专利号 | IN5294CHENP2010A |
| 著作权人 | KONINKLIJKE PHILIPS ELECTRONICS N.V |
| 国家 | 印度 |
| 文献子类 | 发明申请 |
| 其他题名 | Versatile semiconductor package, module and method of operation |
| 英文摘要 | Proposed is a package (10) having at least two pins (11, 12). The package comprises a semiconductor structure (20) having a first function and an electrical circuit (30) comprising at least one circuit element having a second function. The structure (20) and the circuit (30) are electrically connected to the pins (11, 12). Moreover, the package is operable to perform the first and second function by time multiplexing a first (60) and second (70) operating signal through the pins (11, 12). Finally, the first function is a lighting function and the second function is a sensing function. The invention is especially advantageous as it provides a cost effective and versatile miniaturized light emitting package comprising LEDs or laser diodes. fig.1 |
| 公开日期 | 2010-12-10 |
| 申请日期 | 2010-08-25 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/58565]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KONINKLIJKE PHILIPS ELECTRONICS N.V |
| 推荐引用方式 GB/T 7714 | KMETEC JEFFREY D.,VOS FRANS M.. Versatile semiconductor package, module and method of operation. IN5294CHENP2010A. 2010-12-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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