中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Sheet metal processing method using direct diode laser, and direct diode laser processing device for carrying out said method

文献类型:专利

作者ISHIGURO, HIROAKI; SUGIYAMA, AKIHIKO
发表日期2016-04-21
专利号WO2016059937A1
著作权人AMADA HOLDINGS CO.,LTD.
国家世界知识产权组织
文献子类发明申请
其他题名Sheet metal processing method using direct diode laser, and direct diode laser processing device for carrying out said method
英文摘要When processing sheet-metal using a multi-wavelength laser, this sheet metal processing method and direct diode laser processing device result in minimal dross adhesion and allow adherent dross to be easily peeled off. In this sheet metal processing method and direct diode laser processing device, when cutting sheet metal that is 2mm thick or thicker, a laser from a DDL module is irradiated onto the sheet metal, condensed using a condenser lens which has a focal distance f ≧ 150mm and is arranged, with respect to the top surface of the sheet metal, at a focal position Pf with -2.0mm < Pf ≦ approximately 0.0 mm, and, when cutting sheet metal less than 2mm thick, irradiates a laser from the DDL module onto the sheet metal, condensed using a condenser lens which has a focal distance f ≦ 120mm and is arranged, with respect to the top surface of the sheet-metal, at a focal position Pf with 0.0mm < Pf ≦ 2.0mm.
公开日期2016-04-21
申请日期2015-09-17
状态未确认
源URL[http://ir.opt.ac.cn/handle/181661/59037]  
专题半导体激光器专利数据库
作者单位AMADA HOLDINGS CO.,LTD.
推荐引用方式
GB/T 7714
ISHIGURO, HIROAKI,SUGIYAMA, AKIHIKO. Sheet metal processing method using direct diode laser, and direct diode laser processing device for carrying out said method. WO2016059937A1. 2016-04-21.

入库方式: OAI收割

来源:西安光学精密机械研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。