Sheet metal processing method using direct diode laser, and direct diode laser processing device for carrying out said method
文献类型:专利
作者 | ISHIGURO, HIROAKI; SUGIYAMA, AKIHIKO |
发表日期 | 2016-04-21 |
专利号 | WO2016059937A1 |
著作权人 | AMADA HOLDINGS CO.,LTD. |
国家 | 世界知识产权组织 |
文献子类 | 发明申请 |
其他题名 | Sheet metal processing method using direct diode laser, and direct diode laser processing device for carrying out said method |
英文摘要 | When processing sheet-metal using a multi-wavelength laser, this sheet metal processing method and direct diode laser processing device result in minimal dross adhesion and allow adherent dross to be easily peeled off. In this sheet metal processing method and direct diode laser processing device, when cutting sheet metal that is 2mm thick or thicker, a laser from a DDL module is irradiated onto the sheet metal, condensed using a condenser lens which has a focal distance f ≧ 150mm and is arranged, with respect to the top surface of the sheet metal, at a focal position Pf with -2.0mm < Pf ≦ approximately 0.0 mm, and, when cutting sheet metal less than 2mm thick, irradiates a laser from the DDL module onto the sheet metal, condensed using a condenser lens which has a focal distance f ≦ 120mm and is arranged, with respect to the top surface of the sheet-metal, at a focal position Pf with 0.0mm < Pf ≦ 2.0mm. |
公开日期 | 2016-04-21 |
申请日期 | 2015-09-17 |
状态 | 未确认 |
源URL | [http://ir.opt.ac.cn/handle/181661/59037] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | AMADA HOLDINGS CO.,LTD. |
推荐引用方式 GB/T 7714 | ISHIGURO, HIROAKI,SUGIYAMA, AKIHIKO. Sheet metal processing method using direct diode laser, and direct diode laser processing device for carrying out said method. WO2016059937A1. 2016-04-21. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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