Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof
文献类型：专利
| 作者 | KIM, JAY EUNJAE |
| 发表日期 | 2017-09-07 |
| 专利号 | US20170254574A1 |
| 著作权人 | KIM, JAY EUNJAE |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof |
| 英文摘要 | A direct refrigeration cooling platform can cool high heat density sources such as LEDs, IC chip, power amplifiers and laser diodes. The platform utilizes a combination of technologies from a water cooled cold plate design and a vapor compression refrigeration system. The cold plate of the direct refrigeration cooling platform replaces an evaporator in a conventional vapor compression refrigeration cycle. High heat density sources are directly mounted onto the cold plate. Temperature of the cold plate is regulated based on temperature feedback and is maintained above ambient temperatures. For LED applications, a number of LEDs are mounted onto the cold plate of the direct refrigeration cooling platform. Beams of light are distributed via fiber optic light guides to remote and inaccessible locations, where light sources are to be replaced. IC chips are cooled the same way with IC chips attached to the cold plate of the direct refrigeration cooling platform. |
| 公开日期 | 2017-09-07 |
| 申请日期 | 2016-08-30 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/59099]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KIM, JAY EUNJAE |
| 推荐引用方式 GB/T 7714 | KIM, JAY EUNJAE. Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof. US20170254574A1. 2017-09-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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