Soldering system and soldering method
文献类型：专利
| 作者 | FUJISHIMA TOSHITERU; TADAMA SHIGERU; KOBAYASHI HIRONOBU |
| 发表日期 | 2019-04-04 |
| 专利号 | WO2019065065A1 |
| 著作权人 | HORIUCHI ELECTRONICS. CO., LTD |
| 国家 | 世界知识产权组织 |
| 文献子类 | 发明申请 |
| 其他题名 | Soldering system and soldering method |
| 英文摘要 | Provided are a soldering system and a soldering method, whereby solder can be uniformly spread on a to-be-soldered part without damaging a fine soldering target article, and an excellent solder can be achieved. Even after molten solder attaches to the to-be-soldered part, the molten solder is continuously heated by continuously irradiating the molten solder with a semiconductor laser. As a result of the above treatment, an alloy of the to-be-soldered part and the molten solder is formed, the molten solder sufficiently wets the to-be-soldered part, and the molten solder flows to the to-be-soldered part by means of a capillary action. |
| 公开日期 | 2019-04-04 |
| 申请日期 | 2018-08-30 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/59218]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HORIUCHI ELECTRONICS. CO., LTD |
| 推荐引用方式 GB/T 7714 | FUJISHIMA TOSHITERU,TADAMA SHIGERU,KOBAYASHI HIRONOBU. Soldering system and soldering method. WO2019065065A1. 2019-04-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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