Process for producing ultraviolet light emitting elements, and ultraviolet light emitting element
文献类型:专利
作者 | MURAI, AKIHIKO; YASUDA, MASAHARU; GOTO, KOJI; TAKASE, YUJI |
发表日期 | 2015-09-24 |
专利号 | WO2015140849A1 |
著作权人 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
国家 | 世界知识产权组织 |
文献子类 | 发明申请 |
其他题名 | Process for producing ultraviolet light emitting elements, and ultraviolet light emitting element |
英文摘要 | Provided are: a process for producing ultraviolet light emitting elements which makes it possible to heighten the mass productivity and production yield; and an ultraviolet light emitting element. In the process for producing ultraviolet light emitting elements (B1), a wafer (30) obtained by superposing a nitride semiconductor layer (20) of a multilayer structure on a first surface (10a) of a sapphire wafer (10) is divided into the individual ultraviolet light emitting elements (B1). The process for producing ultraviolet light emitting elements (B1) includes a grooving step in which the wafer (30) is irradiated with laser light from the nitride semiconductor layer (20) side to form grooves (31) that extend to somewhere in the thickness direction of the sapphire wafer (10), a grinding step in which the wafer (30) is ground from the second surface (10b) side of the sapphire wafer (10) so that the thickness of the wafer (30) is reduced, and a dividing step in which the wafer (30) is divided along the grooves (31). The process further includes, between the grooving step and the grinding step, a debris removal step in which debris on the surface of the nitride semiconductor layer (20) of the wafer (30) is removed with a pressure-sensitive adhesive tape (40). |
公开日期 | 2015-09-24 |
申请日期 | 2014-10-16 |
状态 | 未确认 |
源URL | [http://ir.opt.ac.cn/handle/181661/61969] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
推荐引用方式 GB/T 7714 | MURAI, AKIHIKO,YASUDA, MASAHARU,GOTO, KOJI,et al. Process for producing ultraviolet light emitting elements, and ultraviolet light emitting element. WO2015140849A1. 2015-09-24. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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