Method for manufacturing laser package
文献类型：专利
| 作者 | NAKAGAKI, MASATOSHI; KOZURU, KAZUMA; OKAHISA, EIICHIRO |
| 发表日期 | 2018-06-28 |
| 专利号 | US20180183205A1 |
| 著作权人 | NICHIA CORPORATION |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method for manufacturing laser package |
| 英文摘要 | A method of manufacturing a laser package includes: providing a plurality of laser devices, each including: a submount, and an edge-emitting semiconductor laser element disposed on the submount; providing one or more optical members; providing a substrate; disposing a first bonding material and a second bonding material on the substrate; placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the laser devices and the one or more optical members to the substrate via the first and second bonding materials. |
| 公开日期 | 2018-06-28 |
| 申请日期 | 2017-12-26 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62346]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NICHIA CORPORATION |
| 推荐引用方式 GB/T 7714 | NAKAGAKI, MASATOSHI,KOZURU, KAZUMA,OKAHISA, EIICHIRO. Method for manufacturing laser package. US20180183205A1. 2018-06-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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