Method for manufacturing light-emitting module, light-emitting module, and device
文献类型:专利
作者 | KAWANISHI, HIDEKAZU; MITOMO, JUGO; SATOU, KEI |
发表日期 | 2019-06-20 |
专利号 | WO2019116654A1 |
著作权人 | SONY CORPORATION |
国家 | 世界知识产权组织 |
文献子类 | 发明申请 |
其他题名 | Method for manufacturing light-emitting module, light-emitting module, and device |
英文摘要 | [Problem] To provide a method for manufacturing a light-emitting module in which a plurality of light-emitting elements can be precisely arrayed with a narrow pitch, a light-emitting module manufactured by the manufacturing method, and a device whereon the light-emitting module is mounted. [Solution] Provided is a method for manufacturing a light-emitting module which includes a plurality of light-emitting element arrays having a plurality of light-emitting elements arrayed along a width direction perpendicular to the direction of a resonator length of the light-emitting elements and a substrate whereon the plurality of light-emitting element arrays is mounted in a plane parallel to the resonator length of the light-emitting elements, wherein the plurality of light-emitting elements in the light-emitting module is arrayed on the substrate at a given interval along the width direction by mounting the light-emitting element arrays on the substrate with the lateral surfaces of the light-emitting element arrays mutually adjoining along the width direction being kept in contact with each other. |
公开日期 | 2019-06-20 |
申请日期 | 2018-09-13 |
状态 | 未确认 |
源URL | [http://ir.opt.ac.cn/handle/181661/62390] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | SONY CORPORATION |
推荐引用方式 GB/T 7714 | KAWANISHI, HIDEKAZU,MITOMO, JUGO,SATOU, KEI. Method for manufacturing light-emitting module, light-emitting module, and device. WO2019116654A1. 2019-06-20. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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