Evaluation of openings in a dielectric layer
文献类型：专利
| 作者 | BORDEN, PETER G.; LI, JIPING; GENIO, EDGAR |
| 发表日期 | 2006-05-04 |
| 专利号 | US20060094136A1 |
| 著作权人 | APPLIED MATERIALS, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Evaluation of openings in a dielectric layer |
| 英文摘要 | A patterned dielectric layer is evaluated by measuring reflectance of a region which has openings. A heating beam may be chosen for having reflectance from an underlying conductive layer that is several times greater than absorptance, to provide a heightened sensitivity to presence of residue and/or changes in dimension of the openings. Reflectance may be measured by illuminating the region with a heating beam modulated at a preset frequency, and measuring power of a probe beam that reflects from the region at the preset frequency. Openings of many embodiments have sub-wavelength dimensions (i.e. smaller than the wavelength of the heating beam). The underlying conductive layer may be patterned into links of length smaller than the diameter of heating beam, so that the links float to a temperature higher than a corresponding temperature attained by a continuous trace that transfers heat away from the illuminated region by conduction. |
| 公开日期 | 2006-05-04 |
| 申请日期 | 2004-11-01 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62496]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | APPLIED MATERIALS, INC. |
| 推荐引用方式 GB/T 7714 | BORDEN, PETER G.,LI, JIPING,GENIO, EDGAR. Evaluation of openings in a dielectric layer. US20060094136A1. 2006-05-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。