Method for drawing a lead wire of a semiconductor element
文献类型：专利
| 作者 | KOYAMA SHIYUUICHI; HORI KENICHI |
| 发表日期 | 1976-12-06 |
| 专利号 | JP1976141580A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Method for drawing a lead wire of a semiconductor element |
| 英文摘要 | PURPOSE:To connect a lead wire with an electrode portion without applying pressure on a semiconductor element, which comprises adhering a connection metal onto the tip of the lead wire, heating the semiconductor element and bonding the lead wire tip to the electrode of the semiconductor element by rubbing the former against the latter. |
| 公开日期 | 1976-12-06 |
| 申请日期 | 1975-05-31 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62745]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | KOYAMA SHIYUUICHI,HORI KENICHI. Method for drawing a lead wire of a semiconductor element. JP1976141580A. 1976-12-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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