Semiconductor photo element incorporating electronic cooling and heating element
文献类型：专利
| 作者 | IKEDA KENJI; SUZAKI WATARU; ISHII MAKOTO; SHIRAHATA KIYOSHI |
| 发表日期 | 1979-09-01 |
| 专利号 | JP1979111778A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor photo element incorporating electronic cooling and heating element |
| 英文摘要 | PURPOSE:To compensate the characteristic change due to temperature change, to make small the device, and to reduce the power loss, by assembling the electronic cooling and heating element. CONSTITUTION:On the element of electronic cooling and heating 23 mounting the n and p type semiconductor chips 231 and 232 having greater Peltier effect, the metal chip 22 is fixed. The laser chip 21 is fixed on the metal piece 22 and the cover 242 is placed by putting it in the package 24 The laser 21 is oscillated by applying power to the electrodes 252 and 253, the temperature of the cooling and heating element 23 is detected with the element 26, the current of the element 23 is controlled, and the laser 21 and the metal chip 22 are kept at a given temperature. When the ambient temperature is lower than the desired value, the direction of power application is made reverse, and temperature is increased. With this constitution, no element is deteriorated even with the continuous laser oscillation at more than 60 deg. and the output is made constant. Further, the package can be made small in size and the power consumption can be made to 1/20 of conventional elements. |
| 公开日期 | 1979-09-01 |
| 申请日期 | 1978-02-21 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62771]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | IKEDA KENJI,SUZAKI WATARU,ISHII MAKOTO,et al. Semiconductor photo element incorporating electronic cooling and heating element. JP1979111778A. 1979-09-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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