Mounting method of semiconductor laser element
文献类型：专利
| 作者 | MATSUI KANEKI; HAYAKAWA TOSHIROU; KURATA YUKIO; YAMAMOTO SABUROU; YANO MORICHIKA |
| 发表日期 | 1981-04-20 |
| 专利号 | JP1981042394A |
| 著作权人 | SHARP KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Mounting method of semiconductor laser element |
| 英文摘要 | PURPOSE:To prevent sputtering of solder produced when mounting the laser element, to improve the descrease of yield due to the shortcircuit of a P-N junction of the laser element and to suppress the improper mount at the time of mounting on a heat sink. CONSTITUTION:The solder 1 of prescribed thickness is covered on the surface of a heat sink 2 by a vacuum evaporation process or the like. The laser element 3 is brought into contact with the P-side electrode 4 on the solder 1, and the cleavage plane of the laser element 3 is mathced with the surface of the heat sink 2. Then, the electrode 4 of the laser element 3 is so retained at higher temperature than the melting temperature of the solder 1 as it is in the state that a load is applied in prescribed gas atmosphere as to be draped with the solder 1 on the heat sink 2, the heat sink 2 is then cooled to solidify the dolder 1, and the laser element 3 is soldered to the heat sink 2. Thus, the improper mounting can be suppressed. |
| 公开日期 | 1981-04-20 |
| 申请日期 | 1979-09-13 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62784]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KK |
| 推荐引用方式 GB/T 7714 | MATSUI KANEKI,HAYAKAWA TOSHIROU,KURATA YUKIO,et al. Mounting method of semiconductor laser element. JP1981042394A. 1981-04-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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