Assembling of semiconductor device
文献类型：专利
| 作者 | MATSUBARA HIROSHI |
| 发表日期 | 1982-01-19 |
| 专利号 | JP1982010286A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Assembling of semiconductor device |
| 英文摘要 | PURPOSE:To perform an accurate assembling of the semiconductor with other optical instruments by a method wherein an element is fixed temporarily when assembling a light-emitting element, a reflected light is received by a light-receiving section by irradiating the light sent from a positioning light source to the element and fixed it after the element has been rotated in such manner that the amount of received light will be reached to maximum. CONSTITUTION:Solder is placed on the die-bonded section 2 provided on the package 1, on which the laser chip 3 such as a light-emitting element is placed and fixed temporarily. Then, leaving a proper interval, the light sent from the positioning light source 11 located on the chip 3 is irradiated on the mirror face 10a of the chip 3 through a half mirror, the reflected light is received by the light-receiving section 13 through the mirror 12 again. In this constitution, the optical axes of the package 1 and the light source 11 are formed in parallel, the chip 3 is rotated on the solder and then fixed when the amount of the received light reached maximum. Through these procedures, the junction of the optical fiber and the like, which will be installed on the package 1, is performed correctly and the application of this method to other purposes can be expanded. |
| 公开日期 | 1982-01-19 |
| 申请日期 | 1980-06-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62798]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | MATSUBARA HIROSHI. Assembling of semiconductor device. JP1982010286A. 1982-01-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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