Assembling method for semiconductor light emitting device
文献类型：专利
| 作者 | HIGUCHI HIDEYO; OOMURA ETSUJI |
| 发表日期 | 1982-04-05 |
| 专利号 | JP1982056984A |
| 著作权人 | MITSUBISHI DENKI KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Assembling method for semiconductor light emitting device |
| 英文摘要 | PURPOSE:To readily assemble a semiconductor light emitting element by etching the edge lines of two surfaces crossing with one another at the front surface side of a heat sink soldering the element along the edge line, chamfering it and soldering the element so that the light emitting end face of the element and the front surface of the sink become in the same plane. CONSTITUTION:The edge line of two surfaces crossing with one another at the front surface side of a heat sink carrying a semiconductor laser 2 is etched along the edge line, and a chamfering part 7 is formed. The light emitting end face 4 of a laser 2 is diposed at the chamfering part 7, and the light emitting unit 3 and the sink 2 are secured to one another by soldering while maintaining the light emitting unit 3 and the side face of the sink 1 in the same plane. Since the chamfering part 7 is produced with rounded chamfering unit 7' in this manner, solder 5 is sufficiently flowed to eliminate the cavity or the like, and even if the position of the laser 2 is slightly displaced, the fluctuation, shortcircuit and leakage of the emitted light can be remarkably reduced. |
| 公开日期 | 1982-04-05 |
| 申请日期 | 1980-09-23 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62805]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI DENKI KK |
| 推荐引用方式 GB/T 7714 | HIGUCHI HIDEYO,OOMURA ETSUJI. Assembling method for semiconductor light emitting device. JP1982056984A. 1982-04-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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