United structure of semiconductor laser and optical fiber
文献类型：专利
| 作者 | SAKAGUCHI HARUO; SEKI NORIO; YAMAMOTO SHIYUU; OKADA AKIRA |
| 发表日期 | 1982-08-26 |
| 专利号 | JP1982138191A |
| 著作权人 | KOKUSAI DENSHIN DENWA KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | United structure of semiconductor laser and optical fiber |
| 英文摘要 | PURPOSE:To avoid coupling rate variation due to temperature changes and stabilize coupling system, by supporting a submount and a fixing member chosen of thermal expansion rate on a substrate when a semiconductor laser device and an optical fiber are mounted on the substrate in one body. CONSTITUTION:A semiconductor laser chip 1 is attached thermally on a substrate 5 via a submount 2. An optical fiber 3 is fixed to the substrate 5 with a use of fixing member 7 after axial matching with the chip Presuming that thermal expansion rates of the submount 2, fixing member 7, and optical fiber 3 are beta1, beta2, and beta3 respectively, and thicknesses are h1, h4, and h5 respectively, the condition on axial matching of the chip 1 and optical fiber 3 at a standard temperature is h1=h4+h5. beta1h1=beta4h4+beta5h5 may be defined to equalize the axial shifting between the chip 1 and optical fiber 3. Therefore, diamond and conventional solder are used for the submount 2 and the fixing member 7 respectively. |
| 公开日期 | 1982-08-26 |
| 申请日期 | 1981-02-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62820]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KOKUSAI DENSHIN DENWA KK |
| 推荐引用方式 GB/T 7714 | SAKAGUCHI HARUO,SEKI NORIO,YAMAMOTO SHIYUU,et al. United structure of semiconductor laser and optical fiber. JP1982138191A. 1982-08-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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