Interlayer bonding method in 3-dimensional element
文献类型：专利
| 作者 | KATOU TAKAAKI; ITAKURA HIDEAKI; KOYAMA HIROSHI |
| 发表日期 | 1983-05-24 |
| 专利号 | JP1983086764A |
| 著作权人 | MITSUBISHI DENKI KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Interlayer bonding method in 3-dimensional element |
| 英文摘要 | PURPOSE:To eliminate the conductive line for an electric coupling and to enable to individual superpose layers by employing light or electromagnetic waves of various wavelengths generated from a semiconductor laser or a photodiode when multilayers forming three-dimensional elements are coupled to each other. CONSTITUTION:Layers 1, 1' formed with respective devices are coupled through an insulating film 2, and a signal which is fed to a sensor or an input unit formed at the layer 1 is fed to a light emitting device 5 such as a semiconductor laser which is contacted with the film 2 side of the layer Then, a laser signal which is produced at the device 5 is fed to a photodetector 6 which is formed at the layer 1' and is contacted with the film 2, and an obtained electric signal is fed externally. In this structure, a light or electromagnetic wave which is produced from a semiconductor laser or a photodiode is emitted for coupling, thereby eliminating the special device for coupling. In this manner, the respective device layers 1, 1' are separately formed, and may be superposed later. |
| 公开日期 | 1983-05-24 |
| 申请日期 | 1981-11-18 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62839]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI DENKI KK |
| 推荐引用方式 GB/T 7714 | KATOU TAKAAKI,ITAKURA HIDEAKI,KOYAMA HIROSHI. Interlayer bonding method in 3-dimensional element. JP1983086764A. 1983-05-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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