Semionductor element having sub mount
文献类型：专利
| 作者 | NISHIZAWA HIDEAKI |
| 发表日期 | 1984-01-10 |
| 专利号 | JP1984003984A |
| 著作权人 | SUMITOMO DENKI KOGYO KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semionductor element having sub mount |
| 英文摘要 | PURPOSE:To improve the reliability of a semiconductor element by reducing strains applied on a semiconductor chip by a method wherein a semiconductor element sub mount composed of crystal material of the same composition as that of the substrate material for the semiconductor element chip is provided. CONSTITUTION:The substrate material of a light emitting diode chip 1 the semiconductor element is supposed as GaAs. The semiconductor element sub mount 13 wherein the front and back surfaces of GaAs single crystals are metallized with Au is adhered on a header 2 with Au-Si alloy solder, the LED chip 1 is die-bonded with Au-Sn alloy solder 3, and further an Au wire 4 is wire-bonded to the LED chip 1 and external leads 5, resulting in the completion of assembly of a LED. Since the semiconductor element chip is adhered on the sub mount composed of material of the same composition as that of the substrate material of the semiconductor chip, coefficients of thermal expansion are equal in both, and therefore the strain due to temperature change does not generate. |
| 公开日期 | 1984-01-10 |
| 申请日期 | 1982-06-29 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62861]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO DENKI KOGYO KK |
| 推荐引用方式 GB/T 7714 | NISHIZAWA HIDEAKI. Semionductor element having sub mount. JP1984003984A. 1984-01-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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