Die bonding apparatus
文献类型：专利
| 作者 | TAJIMA TAKESHI; CHIBA KATSUAKI; KANETOMO MASABUMI; IMAI KUNINORI |
| 发表日期 | 1984-12-04 |
| 专利号 | JP1984214230A |
| 著作权人 | HITACHI SEISAKUSHO KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Die bonding apparatus |
| 英文摘要 | PURPOSE:To avoid the building up of jointing solder by varying arbitrarily a pressing load of a semiconductor chip against a subplate. CONSTITUTION:A semiconductor chip 1 is mounted on a prescribed position of a submount 2 and jointed by melting solder on the submount 2 by heating from beneath the submount 2. The pressing of the chip 1 against the submount 2 is straight pressur type and the load is applied by a pressing rod 17 and a weight 18 put on the rod 17. By blowing the compressed air through side holes 24 of a loading head 19, the chip pressing load can be reduced. |
| 公开日期 | 1984-12-04 |
| 申请日期 | 1983-05-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62884]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI SEISAKUSHO KK |
| 推荐引用方式 GB/T 7714 | TAJIMA TAKESHI,CHIBA KATSUAKI,KANETOMO MASABUMI,et al. Die bonding apparatus. JP1984214230A. 1984-12-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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