Manufacture of chip of semiconductor laser
文献类型：专利
| 作者 | TANAKA HARUO; MUSHIGAMI MASAHITO; MURANISHI MASAYOSHI |
| 发表日期 | 1985-08-28 |
| 专利号 | JP1985165778A |
| 著作权人 | ROHM KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Manufacture of chip of semiconductor laser |
| 英文摘要 | PURPOSE:To improve the productivity and to manufacture in a high yield by handling cleaved small wafer piece as a wafer unit, aligning the pieces, and applying them to a fine scribing line type scriber. CONSTITUTION:A wafer 1 on which many scribing scratches 7 are formed is bonded on a stretchable adhesive sheet 8 to expose the scratches 7. Then, it is cleaved, and many small wafer pieces 11 group are formed in parallel on the sheet 8. Then, the sheet 8 on which the group 11 are bonded in parallel is attracted and held on a movable table 12, scribing scratches 14a as fine scribing lines are formed at the prescribed pitch on the upper surface of the group, thereby obtaining a chip group aligned laterally and longitudinally. The sheet 8 on which the chip group are bonded is largely enlarged, and separated at a suitable interval at the chips. The pieces 11 thus cleaved are handled as wafer units, the pieces 11 are aligned and applied to a finely cutting scriber. Therefore, the productivity can be enhanced, and cracks can be reduced. |
| 公开日期 | 1985-08-28 |
| 申请日期 | 1984-02-07 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62910]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM KK |
| 推荐引用方式 GB/T 7714 | TANAKA HARUO,MUSHIGAMI MASAHITO,MURANISHI MASAYOSHI. Manufacture of chip of semiconductor laser. JP1985165778A. 1985-08-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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