Package for semiconductor device
文献类型：专利
| 作者 | WATANABE HIDEKI; YAMAMOTO MASAKAZU |
| 发表日期 | 1985-10-14 |
| 专利号 | JP1985202959A |
| 著作权人 | HITACHI SEISAKUSHO KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Package for semiconductor device |
| 英文摘要 | PURPOSE:To make a package compact, by forming a supporting wall member with a material, whose thermal expansion coefficient is approximately equal to the thermal expansion coefficient of a substrate, and imparting flexibility to the member. CONSTITUTION:A supporting wall 9 is fixed approximately vertically with a semiconductor-device mounting surface at the lower end part of the wall. The wall is made of Cobal, which has the thermal expansion coefficient that is approximately equal to the thermal expansion coefficient of a ceramic substrate Therefore the wall is directly soldered by gold, tin and the like. An annular groove 10 is formed in the supporting wall 9 so as to reduce the rigidity of the supporting wall 9 and to impart flexibility. Therefore, thermal stress due to the difference in thermal expansion coefficients of a water cooled heat sink 6 and the ceramic substrate 1 is absorbed by the supporting wall 9. |
| 公开日期 | 1985-10-14 |
| 申请日期 | 1984-03-28 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62916]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI SEISAKUSHO KK |
| 推荐引用方式 GB/T 7714 | WATANABE HIDEKI,YAMAMOTO MASAKAZU. Package for semiconductor device. JP1985202959A. 1985-10-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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