Mounting method of semiconductor laser
文献类型：专利
| 作者 | MIZUISHI KENICHI |
| 发表日期 | 1985-12-24 |
| 专利号 | JP1985261185A |
| 著作权人 | HITACHI SEISAKUSHO KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Mounting method of semiconductor laser |
| 英文摘要 | PURPOSE:To reduce the thermal resistance of a semiconductor laser to a large extent by utilizing the spreading effect of heat, by attaching a small mounting substrate to a metallic heat sink so as to hold a semiconductor laser chip as an intermediate medium with respect to the positive and negative electrode surfaces of the semiconductor laser chip. CONSTITUTION:A lead terminal 10 is attached to a copper heat sink 8 consituting the main body of a package through a sintered alumina body 9. A laser chip 1 is soldered to sub mount 13 having heat conducting property beforehand. Said sub mount 13 is soldered to the heat sink 8. Then a metal layer 20, which is formed on the upper surface of the sub mount 13 is connected to the lead terminal 10 by using a gold wire 14. A conducting sub mount 15 having heat conducting property is soldered to a copper block 16 beforehand. The copper block 16 is mounted in alignment with a guide surface 17, which is provided on the heat sink 8. The block 16 is moved, and a solder layer 24, which is provided on the upper surface of the sub mount 15, is contacted with the laser chip |
| 公开日期 | 1985-12-24 |
| 申请日期 | 1984-06-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62928]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI SEISAKUSHO KK |
| 推荐引用方式 GB/T 7714 | MIZUISHI KENICHI. Mounting method of semiconductor laser. JP1985261185A. 1985-12-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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