Die-bonding method for semiconductor laser element
文献类型：专利
| 作者 | KITSUKAWA MASAO; YOSHIKAWA YUKIO |
| 发表日期 | 1986-04-01 |
| 专利号 | JP1986063075A |
| 著作权人 | TOOSOKU KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Die-bonding method for semiconductor laser element |
| 英文摘要 | PURPOSE:To enable to easily perform the positioning of a semiconductor laser element in the Y direction to the mount by a method wherein the semiconductor laser element is made to shift in the Y direction and the drive thereof in the Y direction is made to stop according to an electrical signal from the photo detecting unit when the distance between the oscillating surface of the semiconductor element and the photo detecting unit becomes the prescribed one. CONSTITUTION:When a light from the optical device strikes rectangularly upon the oscillating surface 11 of a rotating semiconductor element 10, the reflected light from the oscillating surface 11 strikes upon the optical device and the motor for rotation of a needle 12 is made to stop. When the angle matching of the oscillating surface 11 of the element 10 is completed in such a way, the Y table of the X and Y tables for alignment is made to shift to the right from the left as shown in the diagram by making the motor for Y direction driving drive. A luminous flux from a photo detecting unit 36 strikes upon the oscillating surface 11 of the element 10 and the reflected light returns to the unit 36. When the distance between the unit 36 and the oscillating surface 11 becomes equal to the focal length (l) of the object glass of the unit 36, an electrical signal is outputted from the unit 36 and the motor for Y direction driving is made to stop. Then, after the needle 12 is made to shift just over the mount, the positioning of the element 10 in the X direction to the mount is performed, and then the element 10 is bonded on the mount. |
| 公开日期 | 1986-04-01 |
| 申请日期 | 1984-09-03 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62941]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TOOSOKU KK |
| 推荐引用方式 GB/T 7714 | KITSUKAWA MASAO,YOSHIKAWA YUKIO. Die-bonding method for semiconductor laser element. JP1986063075A. 1986-04-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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