Setting method of die-bonding position of semiconductor chip for electronic component
文献类型：专利
| 作者 | NAKADA NAOTARO; MUSHIGAMI MASAHITO; ISHIDA YUUJI; FUKADA HAYAMIZU; TANAKA HARUO |
| 发表日期 | 1986-08-06 |
| 专利号 | JP1986174691A |
| 著作权人 | ROHM CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Setting method of die-bonding position of semiconductor chip for electronic component |
| 英文摘要 | PURPOSE:To set a die-bonding position accurately and rapidly by applying a laser light to the end face of a semiconductor chip, by inputting an output from a monitoring photodiode to a noise detector, and by moving the semiconductor chip to a position at which noise is detected. CONSTITUTION:A laser light emitted from na position setting semiconductor laser 12 is applied, through convergent lenses 13 and 14, to the luminant end face of a semiconductor chip 4 placed on the top of a block 3, while the semiconductor chip 4 is adsorbed by a vacuum capillary 11 and moved forward and backward. When the luminant end face of the semiconductor chip 4 coincides with the focus F of the lens, the laser light reflected from the luminant end face returns to the position setting semiconductor laser 12. Then noise the generated in an output from a monitoring photodiode, and consequently a luminescent line which is displayed in an image plane of a synchroscope 16 to indicate the intensity of light turns from the state of a smooth straight line to that of oscillations in indentation H. By moving the semiconductor chip 4 to a position at which noise is detected in the image plane of the synchroscope 16, accordingly, a die-bonding position can be set at a position located at a prescribed distance L. |
| 公开日期 | 1986-08-06 |
| 申请日期 | 1985-01-29 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62963]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM CO LTD |
| 推荐引用方式 GB/T 7714 | NAKADA NAOTARO,MUSHIGAMI MASAHITO,ISHIDA YUUJI,et al. Setting method of die-bonding position of semiconductor chip for electronic component. JP1986174691A. 1986-08-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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