Setting method of die-bonding position of luminant semiconductor chip for semiconductor laser
文献类型：专利
| 作者 | NAKADA NAOTARO; MUSHIGAMI MASAHITO; ISHIDA YUUJI; FUKADA HAYAMIZU; TANAKA HARUO |
| 发表日期 | 1986-08-06 |
| 专利号 | JP1986174690A |
| 著作权人 | ROHM KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Setting method of die-bonding position of luminant semiconductor chip for semiconductor laser |
| 英文摘要 | PURPOSE:To set a die-bonding position accurately, by applying a laser light to the front end face of a luminant semiconductor chip, by disposing one end of an optical fiber on the side of the rear end face of said chip, and by moving the semiconductor chip to a position at which an output detected by an optical detector is maximum. CONSTITUTION:A laser light is applied to the front end face of a luminant semiconductor chip 4 from a position setting semiconductor laser 12, and the semiconductor chip 4 on the top of a block 3 is adsorbed by a vacuum chuck capillary 11 and moved in the vertical and horizontal directions with respect to an axial line C. When a luminant portion in an active layer on the semiconductor chip 4 coincides with the axial line C passing through a fixed point 0 for reference of a stem 2, the laser light is transmitted to one end 15a of an optical fiber 15 through the luminant portion of the active layer, and the maximum output is detected by an optical output detector 16 located at the other end 15b of the fiber. By this method, the luminant semiconductor chip 4 is moved to a position at which the maximum output is detected by the optical output detector 16, and thus a die-bonding position can be set at a position at which the line of the optical axis of laser light transmitted from the semiconductor chip4 is aligned with the axial line C passing through the fixed point 0 as reference point of the stem 2. |
| 公开日期 | 1986-08-06 |
| 申请日期 | 1985-01-29 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/62964]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM KK |
| 推荐引用方式 GB/T 7714 | NAKADA NAOTARO,MUSHIGAMI MASAHITO,ISHIDA YUUJI,et al. Setting method of die-bonding position of luminant semiconductor chip for semiconductor laser. JP1986174690A. 1986-08-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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