Die bonding method for optical semiconductor device
文献类型：专利
| 作者 | ICHIKAWA HIDEKI; SHIOMOTO TAKEHIRO |
| 发表日期 | 1987-06-15 |
| 专利号 | JP1987132330A |
| 著作权人 | SHARP CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Die bonding method for optical semiconductor device |
| 英文摘要 | PURPOSE:To simplify the number of steps for mounting an optical semiconductor device on a heat sink by placing a brazing material on a surface to be die bonded, collapsing the material in a foil shape, and die bonding the device on the surface. CONSTITUTION:A suitable amount of spherical brazing material 1a is placed on a heat sink 2, and collapsed by an iron 4. An optical semiconductor device 3 is die bonded on the collapsed foillike brazing material Thus, the size and the die bonding position of the device can be readily altered. Since the brazing material is formed only on the surface of be die bonded, steps can be simplified. |
| 公开日期 | 1987-06-15 |
| 申请日期 | 1985-12-04 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63007]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP CORP |
| 推荐引用方式 GB/T 7714 | ICHIKAWA HIDEKI,SHIOMOTO TAKEHIRO. Die bonding method for optical semiconductor device. JP1987132330A. 1987-06-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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