Die bonding method for photosemiconductor element
文献类型：专利
| 作者 | ICHIKAWA HIDEKI; SHIOMOTO TAKEHIRO |
| 发表日期 | 1987-06-26 |
| 专利号 | JP1987143496A |
| 著作权人 | SHARP CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Die bonding method for photosemiconductor element |
| 英文摘要 | PURPOSE:To make transfer of wax material easy, by inserting a plate, wherein a foil-type wax material is formed, between a trowel and a heat sink, heating the trowel and the heat sink, and impressing pressure on the trowel while applying supersonic wave. CONSTITUTION:A foil-type wax material 11 is formed by deposition on a Teflon sheet 4. This wax deposition sheet A is inserted between a heat sink 2 and a trowel 5, such as the capillary part of a wire bonder, in the manner in which the foil-type wax material 11 is turned toward the heat sink 2 side. The trowel 5 and the heat sink 2 are heated, and pressure is impressed on the trowel 5 while supersonic wave is applied to the trowel 5. The foil-type wax material 11 is separated from the Teflon sheet 4 and stuck on the die bond surface of the heat sink 2 thereby. Further, a photo-semiconductor element 3 is subjected to die bonding on the foil-type wax material. Thus, it is made easy to take the foil-type wax material 11 off the Teflon sheet 4. |
| 公开日期 | 1987-06-26 |
| 申请日期 | 1985-12-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63012]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP CORP |
| 推荐引用方式 GB/T 7714 | ICHIKAWA HIDEKI,SHIOMOTO TAKEHIRO. Die bonding method for photosemiconductor element. JP1987143496A. 1987-06-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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