Photoelectronic device assembling apparatus
文献类型：专利
| 作者 | FURUHASHI TAKAHIRO; YAZAKI NORIHIRO; TOKUDA MASAHIDE; NEMOTO TSUGIO |
| 发表日期 | 1987-11-02 |
| 专利号 | JP1987252179A |
| 著作权人 | HITACHI TOKYO ELECTRON CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Photoelectronic device assembling apparatus |
| 英文摘要 | PURPOSE:To accurately position fixedly a photodetector opposed to a laser chip by monitoring the photodetecting amount of the photodetector to fix a chip in which the photodetector is so secured that the photodetecting amount becomes maximum to a support. CONSTITUTION:A state 20 for placing a laser chip 10 is placed on a table 18, a chuck 19 is operated to clamp a chip 22 between a pair of chuck pawls 2 In this case, the pawls 21 are contacted with metallized layers 23, 24 formed on the chip 22 to detect a photodetecting current of a photodetector 16. A laser diode driving circuit 44 is operated to oscillate the chip 10, a monitor 45 detects a photodetecting current corresponding to the light quantity of a laser light 9 applied to the photodetector 16, a servo mechanism 46 is controlled to be operated by a controller 47, and the chip 22 is disposed at a position where the photodetecting current becomes maximum. A bonding unit 39 is operated, a laser light is emitted to the low portion 14 of a pedestal 11 under the chip 22, thereby fixing the chip 22 by solder to the low portion 14. |
| 公开日期 | 1987-11-02 |
| 申请日期 | 1986-04-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63023]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI TOKYO ELECTRON CO LTD |
| 推荐引用方式 GB/T 7714 | FURUHASHI TAKAHIRO,YAZAKI NORIHIRO,TOKUDA MASAHIDE,et al. Photoelectronic device assembling apparatus. JP1987252179A. 1987-11-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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