Electronic parts
文献类型：专利
| 作者 | AIKI KUNIO; SASAYAMA ATSUSHI; NEMOTO TSUGIO; KUGIMIYA HARUO |
| 发表日期 | 1987-12-01 |
| 专利号 | JP1987276933A |
| 著作权人 | HITACHI LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Electronic parts |
| 英文摘要 | PURPOSE:To ensure the ultrasonic bonding between a lead and a wire by making the lead of an electronic component prolonged at the inside/outside of a package prolonged in the package thicker than the other part. CONSTITUTION:An optoelectronic device for optical communication applies optical communication by lighting a laser light from a laser diode chip 15 and sending the laser light through an optical fiber calbe to a desired position. The part of the lead 6 prolonged in the inside of a main body 7 in the lead 6 prolonged at the inside/outside of the package main body 7 of the device is formed as a thick lead 22 whose diameter is, e.g., 0.75mmphi, and the part projected from the package is formed as a thin lead 23 whose diameter is, e.g., 0.45mmphi. One end of the part 22 is fixed by welding at the ehad 24 of the part 23 whose diameter is 0.75mmphi. A wire 20 connected to a pedestal 36 is connected to the lead 6 by ultrasonic wave wire bonding and since the part 22 is formed thick, the lead 6 is not vibrated even when the wire 20 is connected and sure bonding is applied. |
| 公开日期 | 1987-12-01 |
| 申请日期 | 1986-05-26 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63028]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI LTD |
| 推荐引用方式 GB/T 7714 | AIKI KUNIO,SASAYAMA ATSUSHI,NEMOTO TSUGIO,et al. Electronic parts. JP1987276933A. 1987-12-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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