Method and apparatus for bonding semiconductor laser
文献类型：专利
| 作者 | YAMAMOTO AKIHIRO; MAKINO YUTAKA; KAINO SHINJI |
| 发表日期 | 1988-03-26 |
| 专利号 | JP1988067793A |
| 著作权人 | 松下電器産業株式会社 |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Method and apparatus for bonding semiconductor laser |
| 英文摘要 | PURPOSE:To surely regulate the direction of light emission from a laser chip within a certain range of error by a method wherein the laser chip is made to emit a light so as to measure the direction of light emission in the state wherein the laser chip is laid on a post directly or through the intermediary of an intermediate chip, and it is bonded after the direction of light emission is corrected. CONSTITUTION:A laser chip 4 is picked up by a pickup device 24, and the sticking position of the laser chip 4 is recognized by a sticking position recognition device. When the recognition can be attained, the exact position, turning attitude, etc. of the pickup device 24 in relation to the center axis are detected and corrected, and the laser chip is laid in a prescribed position on an intermediate chip 3. Next, a voltage from a DC power source 32 is impressed between the pickup device 24 and a stem to make the laser chip 4 emit a light, and it is judged by an emission output detecting device 34 whether an emission output is appropriate or not. When the direction of the light emission from the laser chip 4 is appropriate, a voltage from an electrifying circuit 28 is impressed between electrodes 27a and 27b to electrify a post 2, and thus bonding is conducted. |
| 公开日期 | 1988-03-26 |
| 申请日期 | 1986-09-09 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63045]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 松下電器産業株式会社 |
| 推荐引用方式 GB/T 7714 | YAMAMOTO AKIHIRO,MAKINO YUTAKA,KAINO SHINJI. Method and apparatus for bonding semiconductor laser. JP1988067793A. 1988-03-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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