Mounting device for semiconductor laser
文献类型：专利
| 作者 | ABE TOMOKO; KASAHARA MASAO |
| 发表日期 | 1988-07-26 |
| 专利号 | JP1988181490A |
| 著作权人 | MATSUSHITA ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Mounting device for semiconductor laser |
| 英文摘要 | PURPOSE:To mount a semiconductor laser chip to a screening device without fitting it to a stem by preparing a groove where a semiconductor laser chip is arranged as well as a terminal where the semiconductor laser chip is fixed in the groove. CONSTITUTION:A groove 14 is formed between both sides of a semiconductor laser chip 1 The semiconductor laser chip 11 is placed in the groove 14 and its chip 11 is attached between a heat sink 12 and a terminal 15 using pressure by tightening a screw of its terminal 15 having a spring property. Thus the semiconductor laser chip 11 is mounted to a screening device without equipping a stem with its chip 11 by arranging the groove 14 and terminal 15 to which the semiconductor laser chip 11 is fixed. |
| 公开日期 | 1988-07-26 |
| 申请日期 | 1987-01-23 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63068]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | ABE TOMOKO,KASAHARA MASAO. Mounting device for semiconductor laser. JP1988181490A. 1988-07-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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