Structure for securely positioning between semiconductor laser chip and input lens
文献类型：专利
| 作者 | OKUJIMA HIROKI; TAGAWA KENJI; MASUKO TAKAYUKI; MIURA SHOICHI |
| 发表日期 | 1989-03-20 |
| 专利号 | JP1989073789A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Structure for securely positioning between semiconductor laser chip and input lens |
| 英文摘要 | PURPOSE:To simplify positioning and to enable stable fixation to be performed, by relatively contacting between the minor axis elements of a heat sink member to which a semiconductor laser chip is fixed, and the receiving part of a mounting support member to which an input lens is attached to position between the chip and the lens. CONSTITUTION:A chip carrier 32 having a semiconductor laser chip 30 is fixed to a heat sink member 34 which is provided with a pair of minor axis elements 36. A mounting support member 40 to which a spherical lens 38 for input is attached is then mounted to the heat sink member 34 so that the receiving part 46 of the mounting support member 40 is brought into contact with two positions of the elements 36 in the diameter direction thereof respectively. Under this condition, the elements 36 and the member 40 are relatively moved with respect to the contacting points as reference positions so that the positioning between the chip 30 and the lens 38 is easily performed on the optical axis. And, after this positioning, the contacting points are respectively welded with laser beam, which enable a stable fixation with high physical strength to be performed. |
| 公开日期 | 1989-03-20 |
| 申请日期 | 1987-09-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63104]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | OKUJIMA HIROKI,TAGAWA KENJI,MASUKO TAKAYUKI,et al. Structure for securely positioning between semiconductor laser chip and input lens. JP1989073789A. 1989-03-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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