Sub-mount for optical semiconductor element
文献类型：专利
| 作者 | ANDO SHINJI |
| 发表日期 | 1989-05-26 |
| 专利号 | JP1989134983A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Sub-mount for optical semiconductor element |
| 英文摘要 | PURPOSE:To prevent a defect from occuring in a monitoring current of a laser diode due to a surface roughness of a solder during the assembly of the diode by a method wherein a step is provided to a surface of a sub-mount on a semiconductor laser chip side. CONSTITUTION:A Si conductive sub-mount base 2 is mounted on a heat dissipating metal block 3. Furthermore, a semiconductor laser chip 1 is mounted on the base 2. A step 2a is formed on the surface of the base 2 on the chip side, and the part of the surface of the base 2 behind the rear end face of the chip 1 is made to be lower than the junction face of the sub-mount 2 with the chip 1 by 20-30mum. Concerning the sub-mount 2 shaped as mentioned above, even if a protrusion is generated on the surface of a Sn solder layer 4c, a light emitting point of the chip 1 is prevented from being screened owing to the step 2a, so that a defective monitoring current is prevented. |
| 公开日期 | 1989-05-26 |
| 申请日期 | 1987-11-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63118]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | ANDO SHINJI. Sub-mount for optical semiconductor element. JP1989134983A. 1989-05-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。