Assembling method for semiconductor laser
文献类型：专利
| 作者 | OGAWA HIROSHI; HORIKAWA HIDEAKI; WADA HIROSHI; KUNII TATSUO |
| 发表日期 | 1989-06-13 |
| 专利号 | JP1989150377A |
| 著作权人 | OKI ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Assembling method for semiconductor laser |
| 英文摘要 | PURPOSE:To obtain a laser device having excellent temperature characteristics by a method wherein the heat generated on a light emitting part is dispersed by a pair of heat sinks and the temperature rise on the light emitting part is suppressed by removing the substrate part of a semiconductor laser chip, and the remaining element forming part only is pinched by the heat sinks from the upper and the lower parts. CONSTITUTION:A P-side electrode is formed on the P-InGaAsP etching-stop layer 13 on which a semiconductor laser chip 11 is exposed. Also, a P-side heat sink 25 consisting or silicon and the like is bonded on a stem 24. Then, the electrode side on the P-side of the element forming part 11a of the chip 11 is bonded on the heat sink 25 with the structure, composed of an N-side beat sink 23 and the element forming part 11a of the chip 11, by turning upside down. By assembling a semiconductor laser as above-mentioned, the structure in which the element forming part 11a only of the chip 11 is pinched by the upper and the lower heat sinks is obtained, the heat generated by the heat- generating part in the element forming part 11a is quickly dispersed by the upper and the lower heat sinks 23 and 25, and the temperature rise of the heat- generating part can be suppressed. |
| 公开日期 | 1989-06-13 |
| 申请日期 | 1987-12-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63122]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OKI ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | OGAWA HIROSHI,HORIKAWA HIDEAKI,WADA HIROSHI,et al. Assembling method for semiconductor laser. JP1989150377A. 1989-06-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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