Optical semiconductor assembly
文献类型:专利
作者 | ASANO SABUROU; MIURA SHOICHI; MASUKO TAKAYUKI |
发表日期 | 1989-07-06 |
专利号 | JP1989171290A |
著作权人 | FUJITSU LTD |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Optical semiconductor assembly |
英文摘要 | PURPOSE:To maintain a high optical coupling efficiency stably for a long period of time by securing the section having relatively low thermal conductivity of a chip carrier to a lens holder by laser welding. CONSTITUTION:A chip carrier 11 is formed by integrally brazing a heat sink 12 to a lens holder supporter 13, and the supporter 13 is formed with a lens holder mounting hole 13a in a rectangular parallelepiped block made of a material having relatively low thermal conductivity. A lens holder 14 is formed of the same material as that of the supporter 13 of a lens holder When the carrier 11 is secured to the holder 14, the holder 14 is slid longitudinally in the hole 13a, and the sliding end A is laser-welded at a suitable position. In this case, since the thermal conductivities of the supporter 13 and the holder 14 are low, the laser radiated part is locally melted and solidified, thereby forming a welded part which is not deformed in an ageing manner. |
公开日期 | 1989-07-06 |
申请日期 | 1987-12-25 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/63126] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | FUJITSU LTD |
推荐引用方式 GB/T 7714 | ASANO SABUROU,MIURA SHOICHI,MASUKO TAKAYUKI. Optical semiconductor assembly. JP1989171290A. 1989-07-06. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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