Machining of heat sink for laser device
文献类型：专利
| 作者 | SAKAMOTO YASUHIRO |
| 发表日期 | 1989-08-11 |
| 专利号 | JP1989200687A |
| 著作权人 | SONY CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Machining of heat sink for laser device |
| 英文摘要 | PURPOSE:To prevent abrasive sags from being produced as well as locate a bonding position of a laser device in a manner that it is not away from a package window of a semiconductor laser by machining a heat sink into such a configuration that a pair of protrusions are formed on the exit surface of a laser light beam so as to extend from the edge on the device bonding surface side of the heat sink to an edge opposite to the former, and then abrading the device bonding surface. CONSTITUTION:A heat sink 1 includes a pair of protrusions 6, 6 formed integrally on a surface 4 which has an edge 3 jointly with a device bonding surface 2, the protrusions extending from the edge 3 to an edge 5 located in opposition to the edge 3. The device bonding surface 2 of the heat sink 1 is abraded. Thereupon, although edges which are possessed jointly by the upper surfaces of the protrusions 6, 6 and the device bonding surface 2 suffer from abrasive sags, the edge 3 enjoys no such abrasive sags. Thereafter, the upper surfaces of the protrusions 6, 6 are abraded. Hereby, a distance 1 between a position 7 where a laser device is bonded and the uppermost portion of the heat sink 1 can be shortened. |
| 公开日期 | 1989-08-11 |
| 申请日期 | 1988-02-05 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63137]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORP |
| 推荐引用方式 GB/T 7714 | SAKAMOTO YASUHIRO. Machining of heat sink for laser device. JP1989200687A. 1989-08-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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