Electrode for mounting chip parts
文献类型：专利
| 作者 | SAWA KAZUHIRO |
| 发表日期 | 1990-01-08 |
| 专利号 | JP1990002654A |
| 著作权人 | 松下電器産業株式会社 |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Electrode for mounting chip parts |
| 英文摘要 | PURPOSE:To provide a sub-mount of an electrode structure strong in adhesive strength to a semiconductor chip and strong in bonding strength by employing different electrode materials, one for a portion for mounting chip parts and the other for a section for connection to an external electrode. CONSTITUTION:Elements 3 to 8 formed on a surface of an insulator 2 are in electrical contact with chip parts on one ends thereof and serve as connection parts to an external terminal on the other ends thereof. Electrode materials 4-6 of said one ends are different from electrode materials 7, 8 of said the other ends. For example, SiO2 2 is formed on Si 1, and then Cr.Pt.Au 3 is formed on the same. Then, after Sn 4 is deposited, a shape inverted to the shape of the Sn 4 electrode is formed with use of a resist, and an AuSn alloy 5 and Au 6 are deposited and lifted off. Thereafter, Sn other than the remaining Au/Sn alloy 5 and the Au 6 electrode is removed by etching to form an electrode of a portion of placing the chip parts. Then Ti 7 and Au 8 are deposited and patterned to form a bonding pad electrode. |
| 公开日期 | 1990-01-08 |
| 申请日期 | 1988-06-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63160]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 松下電器産業株式会社 |
| 推荐引用方式 GB/T 7714 | SAWA KAZUHIRO. Electrode for mounting chip parts. JP1990002654A. 1990-01-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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