Conveyance apparatus of laser diode chip
文献类型：专利
| 作者 | INOUE TETSUKAZU |
| 发表日期 | 1990-02-07 |
| 专利号 | JP1990037793A |
| 著作权人 | ROHM CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Conveyance apparatus of laser diode chip |
| 英文摘要 | PURPOSE:To secure the continuity of a bonding operation and to enhance its efficiency by providing a stepwise feed means where a chip carrier reached to a pickup part is fed stepwise at a prescribed distance at a prescribed pitch while it is pulled forward by being hooked by means of a hook part. CONSTITUTION:A conveyance route 23 which supports a chip carrier (f) so as to be slid in a longitudinal direction is installed; a pickup part 24 where a heater has been installed is installed at a proper part of this conveyance route 23. When the chip carrier (f) from a feed mechanism 27 is shifted to an initiation end of the conveyance route 23, a first transfer means 29 transfers this chip carrier (f) to the pickup part 25. When the chip carrier (f) which has reached the pickup part 25 is pulled by being hooked by means of a hook part 22 installed at its tip part, the chip carrier (f) is shifted stepwise by means of a stepwise feed means 4 In addition, the chip carrier (f) which has been picked up is transferred to a termination end of the conveyance route 23 by using a second transfer means 44. Thereby, the continuity of a bonding operation is secured; the operation efficiency can be enhanced. |
| 公开日期 | 1990-02-07 |
| 申请日期 | 1988-07-27 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63168]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM CO LTD |
| 推荐引用方式 GB/T 7714 | INOUE TETSUKAZU. Conveyance apparatus of laser diode chip. JP1990037793A. 1990-02-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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