Heat sinking mounting substrate of photocircuit element and packaging
文献类型：专利
| 作者 | NAGAOKA SHINJI; NISHI NORIO |
| 发表日期 | 1990-02-15 |
| 专利号 | JP1990045985A |
| 著作权人 | NIPPON TELEGR & TELEPH CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat sinking mounting substrate of photocircuit element and packaging |
| 英文摘要 | PURPOSE:To prevent misregistration of a photocircuit element which develops when mounted to a heat sinking substrate by providing a locally concentrated heating means by a heat generating resistance film formed on the heat sinking substrate itself and by controlling misregistration of the photocircuit element before and after heating. CONSTITUTION:A heating resistance film 17 is formed in an inner layer of a substrate section 12b of a ceramic package substrate 12 formed in one-body. The heating resistance film 17 is energized through double feeding electrode films 17a, 17b which are connected to a feed lead 18 to locally and concentratively heat a mounting area of a photosemiconductor element 10 of the substrate section 12b and to fuse a corresponding brazing material 15 for junction. Then a heat generating substrate 11 whereto the photosemiconductor element 10 is mounted is located to a section of the fused brazing material 15, and energization is stopped for cooling after optical axes X, Y are adjusted with optical fiber 13. According to this constitution, it is possible to control thermal expansion of the heat generating substrate 11 and to prevent misregistration of the photosemiconductor element 10 after junction. |
| 公开日期 | 1990-02-15 |
| 申请日期 | 1988-08-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63170]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NIPPON TELEGR & TELEPH CORP |
| 推荐引用方式 GB/T 7714 | NAGAOKA SHINJI,NISHI NORIO. Heat sinking mounting substrate of photocircuit element and packaging. JP1990045985A. 1990-02-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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