Chip bonding preform material feeder of laser diode chip
文献类型：专利
| 作者 | INOUE TETSUKAZU; SHIMIZU SHUNJI; YAMAZAKI KAZUTOSHI |
| 发表日期 | 1990-03-12 |
| 专利号 | JP1990071576A |
| 著作权人 | ROHM KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Chip bonding preform material feeder of laser diode chip |
| 英文摘要 | PURPOSE:To simplify a device, to supply a constant amount of indium, and to enable a bonding rate to be high by a method wherein a small amount of a molten preform material on a roller is transferred through a dip and carry pin onto a heat sink of a stem which waits at a bonding position and supplied and sticked onto the heat sink. CONSTITUTION:A dip and carry pin 5 transfers an adequate amount of indium onto its tip as touching molten indium on the circumferential face of a roller 4 stopped inside a preform material supply source 1, and moves to a stem d and touches a heat sink h of it to transfer the molten indium onto it. And, indium transferred onto the heat sink h is stirred through the rotation of an eccentric protrusion 5b and made to fit well with the surface of the heat sink h. Here, the stem d is kept at a temperature of 200 deg.C or so through a heater. The dip and carry pin 5, which has finished supplying molten indium onto the heat sink h as mentioned above, is made to return to the preform material supply source 1 and repeats the preceding operation. |
| 公开日期 | 1990-03-12 |
| 申请日期 | 1988-09-06 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63174]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM KK |
| 推荐引用方式 GB/T 7714 | INOUE TETSUKAZU,SHIMIZU SHUNJI,YAMAZAKI KAZUTOSHI. Chip bonding preform material feeder of laser diode chip. JP1990071576A. 1990-03-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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