Bonding head in laser diode chip bonding device
文献类型：专利
| 作者 | INOUE TETSUKAZU |
| 发表日期 | 1990-05-10 |
| 专利号 | JP1990122683A |
| 著作权人 | ローム株式会社 |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Bonding head in laser diode chip bonding device |
| 英文摘要 | PURPOSE:To perform control in all directions easily and accurately by driving a bonding collet for holding a chip in the directions of Z-axis and Y-axis. CONSTITUTION:A bonding collet 25 is moved in the directions of Z-axis and Y-axis to pick up a sub-mount 8 provided with a chip and placed on a chip carrier 10 through a process shown by an arrow (a) then the sub-mount 8 is carried onto the bonding section of a stem 3 which is secured mechanically. The temperature of the stem has risen at this time, and solid state medium such as silver-palladium placed between the sub-mount 8 and the bonding section in order to secure them is in fused state. Consequently, the sub-mount 8 provided with a chip held by the bonding collet 25 can be slided in the directions of X-axis and an angle theta on the bonding section of the stem. Then the bonding collet 25 is moved finely in the directions of X-axis and the angle theta so that the chip 5 takes a correct attitude with the attitude of the chip 5 on the stem being detected through an optical image pick-up device. |
| 公开日期 | 1990-05-10 |
| 申请日期 | 1988-11-01 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63184]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ローム株式会社 |
| 推荐引用方式 GB/T 7714 | INOUE TETSUKAZU. Bonding head in laser diode chip bonding device. JP1990122683A. 1990-05-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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