Semiconductor laser assembly with built-in electronic cooling element
文献类型：专利
| 作者 | GOTO MASAMI |
| 发表日期 | 1990-08-03 |
| 专利号 | JP1990197185A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser assembly with built-in electronic cooling element |
| 英文摘要 | PURPOSE:To enable the high speed drive of a semiconductor laser keeping the reduction minimum in temperature difference between two faces of an element by a method wherein a high electric conductor where an LD chip is mounted is directly fixed to a metal case. CONSTITUTION:An LD chip 21 is mounted on end fixed to a stem 31 formed of a material which is high in electric conductivity and low in thermal conductivity. The stem 31 is extended to be directly connected and fixed to the inner face of a metal case 27. A high frequency board 32, on which an electric signal transmitting pattern is formed, is pasted on the stem 3 And, the stem 31 is mounted on a Peltier element 23, where the element 23 is composed of a semiconductor element possessed of the Peltier effect sandwiched between ceramic boards 24 and 25. then a current and a voltage applied to the electrodes of the element 23 are controlled, thermal energy is transferred in one direction through the element 23 to enable the element 21 to be cooled down to an appropriate temperature. |
| 公开日期 | 1990-08-03 |
| 申请日期 | 1989-01-26 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63198]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | GOTO MASAMI. Semiconductor laser assembly with built-in electronic cooling element. JP1990197185A. 1990-08-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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