Structure for fixing LD chip carrier
文献类型：专利
| 作者 | SATO SHUNICHI; MASUKO TAKAYUKI; MIURA SHOICHI; HIGAKI TETSUSHI |
| 发表日期 | 1990-10-02 |
| 专利号 | JP1990247093A |
| 著作权人 | 富士通株式会社 |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Structure for fixing LD chip carrier |
| 英文摘要 | PURPOSE:To surely fix an LD chip carrier on a Peltier element and to improve a cooling (heating) effect by irradiating a metal member embedded on a ceramic base plate of the Peltier element and the LD chip carrier with a laser beam to weld these together. CONSTITUTION:An LD chip is mounted on the LD chip carrier 1 made of stain less steel. Low heat conductive metal, stainless steel, for instance is embedded (in an inverted T shape so as to hardly slip out) on the ceramic base plate 2a for insulating the Peltier element 2 by the method such as sintering and further, the difference H in level is provided between the upper surface of the embedded member 5 and the contact surface S between the LD chip carrier 1 and the ceramic base plate 2a. The LD chip carrier 1 and the embedded member 5 are irradiated with the laser beam. By this method, the laser beam irradiation parts of both members 1 and 5 are molten and integrated and the LD chip carrier 1 can be fixed on the embedded member 5 and in this turn, on the ceramic plate 2a of the Peltier element 2 and cooling (heating) efficiency due to improvement of adhesion between both is maintained and improved. |
| 公开日期 | 1990-10-02 |
| 申请日期 | 1989-03-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/63209]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 富士通株式会社 |
| 推荐引用方式 GB/T 7714 | SATO SHUNICHI,MASUKO TAKAYUKI,MIURA SHOICHI,et al. Structure for fixing LD chip carrier. JP1990247093A. 1990-10-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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