Vcsel module and manufacture thereof.
文献类型:专利
作者 | GRONENBORN STEPHAN; PRUIJMBOOM ARMAND; DUMOULIN RAIMOND LOUIS; MILLER MICHAEL |
发表日期 | 2016-07-01 |
专利号 | IN7089CHENP2014A |
著作权人 | KONINKLIJKE PHILIPS N.V. |
国家 | 印度 |
文献子类 | 发明申请 |
其他题名 | Vcsel module and manufacture thereof. |
英文摘要 | The invention describes a method of manufacturing a VCSEL module (100) comprising at least one VCSEL chip (33) with an upper side (U) and a lower side (L) and with a plurality of VCSEL units (55) on a common carrier structure (35) the VCSEL units (55) comprising a first doped layer (50) of a first type facing towards the lower side (L) and a second doped layer (23) of a second type facing towards the upper side (U). The method comprises the steps of dividing the VCSEL chip (33) into a plurality of subarrays (39a 39b 39c 39d 39e 39f 39g 39h 39i) with at least one VCSEL unit (55) each electrically connecting at least some of the subarrays (39a 39b 39c 39d 39e 39f 39g 39h 39i) in series. The invention also describes a VCSEL module ( 100) manufactured in such process. |
公开日期 | 2016-07-01 |
申请日期 | 2014-09-24 |
状态 | 未确认 |
源URL | [http://ir.opt.ac.cn/handle/181661/63381] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | KONINKLIJKE PHILIPS N.V. |
推荐引用方式 GB/T 7714 | GRONENBORN STEPHAN,PRUIJMBOOM ARMAND,DUMOULIN RAIMOND LOUIS,et al. Vcsel module and manufacture thereof.. IN7089CHENP2014A. 2016-07-01. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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