中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Heat treatment for compound semiconductor wafer

文献类型:专利

作者WATANABE HISATSUNE; HAYASHI ITSUO
发表日期1982-09-08
专利号JP1982145311A
著作权人NIPPON DENKI KK
国家日本
文献子类发明申请
其他题名Heat treatment for compound semiconductor wafer
英文摘要PURPOSE:To improve the quality of a compound semiconductor crystal which is contaminated by a heavy metal by covering III-V group semiconductor compound wafer with a thermal decomposition controlling protection film in a condition having a misfit transposition based on grating constant difference. CONSTITUTION:As an example, a three-dimensional mixed crystal of Ga Aso9Po is formed at 2mu by a vapor growth processing on the surface of GaAs epitaxial wafer for infrared ray luminous diode use and a misfit transposition is introduced. The surface of the GaAso9Po layer is covered with Si3N4 film of 0.1mu and a heat treatment is provided for the surface at 850 deg.C for 5hr in an argon atmosphere. The light emitting effect due to the heat treatment as described above can be improved remarkably and the quality of the compound semiconductor crystal contaminated also be improved remarkably.
公开日期1982-09-08
申请日期1981-03-03
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/64179]  
专题半导体激光器专利数据库
作者单位NIPPON DENKI KK
推荐引用方式
GB/T 7714
WATANABE HISATSUNE,HAYASHI ITSUO. Heat treatment for compound semiconductor wafer. JP1982145311A. 1982-09-08.

入库方式: OAI收割

来源:西安光学精密机械研究所

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