Light emitting element and its manufacture
文献类型：专利
| 作者 | TAKAHASHI YUKIO; ISHII AKIRA |
| 发表日期 | 1987-05-08 |
| 专利号 | JP1987098686A |
| 著作权人 | HITACHI LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting element and its manufacture |
| 英文摘要 | PURPOSE:To make it possible to cut a wafer into pieces without elongation of Au in the case where chips are manufactured by cleaving a wafer, by forming an Au electrode on a wafer surface in the manner in which the part to be cut in the direction rectangular to a resonator is made thinner than the other region on the wafer. CONSTITUTION:On the corresponding parts of anode electrode 10 to the both ends of a resonator 12, an overhang-protection layer 13 thinner than the other parts is formed. The part of wafer 14, which becomes the end part of a resonator 12 in the state of a chip when a laser chip is manufactured by cutting the wafer into pieces, is previously coated with a thin Au film. As the result of this, it does not occur that Au elongates to its utmost, becomes difficult to be cut, and overhangs like eaves in a conventional manner when the wafer 14 is cleaved along a cleavage line. Consequently, an anode electrode 10 does not hang, and the short circuit defect caused by a hanging electrode does not generate. |
| 公开日期 | 1987-05-08 |
| 申请日期 | 1985-10-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/64586]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI LTD |
| 推荐引用方式 GB/T 7714 | TAKAHASHI YUKIO,ISHII AKIRA. Light emitting element and its manufacture. JP1987098686A. 1987-05-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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