中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Method for evaluating epitaxial layers and test pattern for process evaluation

文献类型:专利

作者MIYASHITA, MOTOHARU, C/O MITSUBISHI DENKI K.K.; OGASAWARA, NOBUYOSHI, C/O MITSUBISHI DENKI K.K.; KIMURA, TADASHI, C/O MITSUBISHI DENKI K.K.
发表日期1995-12-06
专利号EP0632494A3
著作权人MITSUBISHI DENKI KABUSHIKI KAISHA
国家欧洲专利局
文献子类发明申请
其他题名Method for evaluating epitaxial layers and test pattern for process evaluation
英文摘要In a method for evaluating thickness of a semiconductor layer (20) epitaxially growing on a main surface of a substrate (1), a plurality of stripe-shaped ridges (12) extending in a prescribed direction are formed on the surface of the substrate, and a semiconductor layer (20) is epitaxially grown on the surface of the substrate including the stripe-shaped ridges while irradiating the stripe-shaped ridges with light (21) and monitoring diffracted light (22,23) from the stripe-shaped ridges to evaluate the thickness of the epitaxially growing semiconductor layer. Therefore, the thickness of the epitaxial layer is evaluated with high precision during the epitaxial growth process.
公开日期1995-12-06
申请日期1994-06-06
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/64737]  
专题半导体激光器专利数据库
作者单位MITSUBISHI DENKI KABUSHIKI KAISHA
推荐引用方式
GB/T 7714
MIYASHITA, MOTOHARU, C/O MITSUBISHI DENKI K.K.,OGASAWARA, NOBUYOSHI, C/O MITSUBISHI DENKI K.K.,KIMURA, TADASHI, C/O MITSUBISHI DENKI K.K.. Method for evaluating epitaxial layers and test pattern for process evaluation. EP0632494A3. 1995-12-06.

入库方式: OAI收割

来源:西安光学精密机械研究所

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