Plastic encapsulation of optoelectronic devices for optical coupling
文献类型：专利
| 作者 | TARTAGLIA, MICHAEL L.; EMBRY, CARL; STIEHL, MARK; BINGAMAN, TIMOTHY |
| 发表日期 | 2002-12-05 |
| 专利号 | US20020181899A1 |
| 著作权人 | OPTICAL COMMUNICATION PRODUCTS, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Plastic encapsulation of optoelectronic devices for optical coupling |
| 英文摘要 | A method and apparatus for encapsulating optoelectronic devices provides for accurately positioning and shaping an encapsulant by actively referencing the device die upon which the optoelectronic devices are formed. A molding tool is accurately aligned to the optoelectronic devices in the x, y and theta directions using mechanical guides and is aligned in the z direction by actively referencing the device die. The shaped encapsulant is preferably an angled wedge having a minimum thickness over the optoelectronic devices to provide a high coupling efficiency and an increased thickness in other portions to fully encapsulate wire bond connections, for example. The method also provides for using the mechanical guides to align and couple optical fibers to the optoelectronic devices. In one exemplary embodiment, the end face of the optical fiber forms a conterminous interface with the top surface of the encapsulant, and the interface is obliquely angled with respect to the surface of the device die. |
| 公开日期 | 2002-12-05 |
| 申请日期 | 2001-11-09 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/66141]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OPTICAL COMMUNICATION PRODUCTS, INC. |
| 推荐引用方式 GB/T 7714 | TARTAGLIA, MICHAEL L.,EMBRY, CARL,STIEHL, MARK,et al. Plastic encapsulation of optoelectronic devices for optical coupling. US20020181899A1. 2002-12-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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