Assembly of semiconductor
文献类型：专利
| 作者 | NANBARA SEIJI; YAGI TETSUYA |
| 发表日期 | 1991-10-08 |
| 专利号 | JP1991227084A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Assembly of semiconductor |
| 英文摘要 | PURPOSE:To move a laser chip to a prescribed position so as to enable the light emitting point of a laser to be uniquely fixed to a sub-mount by a method wherein a laser chip is pressure-joined to a sub-mount protrudent part and held for a some time at a temperature higher than the melting point of solder. CONSTITUTION:A laser chip 3 is die-bonded to a sub-mount 1 by a method that the laser chip 3 whose assembly surface is coated with a metallized layer 2, a sub-mount 1 is coated with a metallized layer 2, the chip 3 and the sub- mount 1 are made to stand for a some time at a temperature higher than the fusing point of solder, and then the sub-mount 1 and chip 3 are cooled. Then, when a voltage is applied between the upper part of the laser chip 3 and the lower part of the sub-mount 1 to enable a current larger than a laser oscillation threshold current flows between them, a laser beam is emitted from a light emitting point 4. By this setup, the surface tension of solder acts on a laser chip to move it so as to uniquely fix the light emitting point of the laser chip to a sub-mount. |
| 公开日期 | 1991-10-08 |
| 申请日期 | 1990-01-31 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/67668]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | NANBARA SEIJI,YAGI TETSUYA. Assembly of semiconductor. JP1991227084A. 1991-10-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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