中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Processing of semiconductor substrate

文献类型:专利

作者NAGAO SHIGERU; FURUIKE SUSUMU
发表日期1984-03-26
专利号JP1984051524A
著作权人MATSUSHITA DENKI SANGYO KK
国家日本
文献子类发明申请
其他题名Processing of semiconductor substrate
英文摘要PURPOSE:To remove residual In securely and protect an epitaxial growth surface from damage by a method wherein after a III-V compound semiconductor layer is formed on a semiconductor substrate by epitaxial growth in a solution whose solvent is In the substrate is immersed in metal Ga at low temperature. CONSTITUTION:An InP substrate 4 on which an epitaxial growth layer is formed is immersed in melted metal Ga kept in a carbon crucible at the temperature 200 deg.C and the temperature is kept at 200 deg.C about 30min. By this process, a small amount of In remained on the substrate produces Ga-rich In-Ga solution with the metal Ga. Then the crucible is cooled to the room temperature and an In-Ga alloy layer is formed on the substrate 4. Because a eutectic temperature of the In-Ga alloy is approximately as low as 15.7 deg.C, it isn't necessary to heat the substrate 4 to the temperature higher than 156 deg.C, a melting point of pure In, to remove the residual In. The In-Ga solution on the substrate can be easily wiped off by soft textile such as a cotton ball after immersed in warm water approximately 40 deg.C so that damage or cracking which occurs when the substrate is heated to high temperature for removing In by conventional method.
公开日期1984-03-26
申请日期1982-09-17
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/67793]  
专题半导体激光器专利数据库
作者单位MATSUSHITA DENKI SANGYO KK
推荐引用方式
GB/T 7714
NAGAO SHIGERU,FURUIKE SUSUMU. Processing of semiconductor substrate. JP1984051524A. 1984-03-26.

入库方式: OAI收割

来源:西安光学精密机械研究所

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